Scanning electron microscopy (SEM)
This is our key tool for reverse engineering work, where we use a scanning electron beam to provide detailed micrographs with submicron resolution.
Image processing:
Advanced CMOS processes use Multilayer interconnect structures of Aluminum made by Chemical Mechanical Polishing (CMP) or Copper dual Damascene processes. Both structures are dense, dummy filled and content six and more metal layers so is very hard to trace the signal paths and restore interconnection scheme.
Semiconductors Research at first digital processed initial images - extract topology information as wires or vias from each layer separately, second stitch all interconnection layers together with accurate alignment between and next extract the interconnection scheme.
Device analysis:
Semiconductor Research is capable of analyzing all kinds of ICs circuitries, including different process of CMOS, BiCMOS, Bipolar and etc. made by different design rules of Analog, Digital and Mixed-signal.
Various optical microscopes
